From Material To Mission

© SPACEREL

Engineering confidence. From component to system.

Qualification & Reliability for Mission‑Critical Electronics

Specialist reliability engineering, qualification and failure analysis for mission-critical electronic components and systems.

Reliability · Qualification · Failure analysis

01 / Capabilities

Four disciplines. One engineering perspective.

Explore all capabilities
01

Reliability Engineering

Independent reliability engineering for electronics, semiconductor devices and mission-critical systems. Identify failure risks, plan targeted testing and build evidence for informed decisions throughout product life.

02

Component & System Qualification

Independent qualification engineering for electronic components, semiconductor devices and assemblies. Develop standards-informed test strategies, assess qualification gaps and establish evidence of suitability for demanding applications.

03

Failure Analysis

Independent electronic and semiconductor failure analysis for components, PCBAs and hybrid microelectronics. Investigate failure mechanisms, identify root causes and develop evidence-based corrective actions.

04

Research & Development

Applied research and experimental development in microelectronics, electronic materials and reliability technologies for demanding applications.

02 / Industries

Built around the demands of your application.

Different environments. Different failure mechanisms. The same need for defensible engineering decisions.

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03 / Engineering Challenges

Where engineering evidence makes the difference.

Unexpected failures, uncertain service life, design changes and qualification requirements can introduce significant technical and programme risks. Addressing these challenges requires more than running additional tests. It means understanding how the hardware is designed, manufactured and operated, identifying credible failure mechanisms, and determining what the available evidence actually demonstrates. At SPACEREL, we combine practical investigation with reliability analysis and targeted verification to resolve technical uncertainties, assess risks and support informed engineering decisions. Whether a product is in early development, approaching qualification or already in service, our focus is on establishing the evidence needed to move forward with confidence.

  1. 01

    Unexpected hardware failures

    A semiconductor device, electronic assembly or complete system can fail during development, qualification or operation, often without an immediately apparent cause. Electrical overstress, material degradation, manufacturing defects and environmental exposure can produce similar symptoms through very different mechanisms. We investigate the failure evidence, examine potential root causes and identify the analyses needed to distinguish between them, providing a technical basis for corrective action and preventing recurrence.

    Failure investigation & root cause
  2. 02

    Uncertain service life

    Demonstrating reliable operation over years or decades is particularly challenging when hardware is exposed to elevated temperatures, electrical loading, thermal cycling or other demanding service conditions. Conventional test durations rarely represent the intended operating life directly. We evaluate relevant degradation mechanisms, operating profiles and available test data to develop reliability assessments, accelerated testing strategies and life predictions, with clear consideration of model assumptions and uncertainty.

    Lifetime modelling & reliability assessment
  3. 03

    Qualification gaps

    A product may perform as intended yet still lack sufficient evidence to demonstrate compliance with its operational or qualification requirements. Inappropriate stress conditions, insufficient sample sizes, unclear acceptance criteria or incomplete test coverage can undermine an otherwise extensive programme. We help translate application requirements and applicable standards into structured qualification plans, justified test conditions and traceable evidence, identifying gaps that need to be addressed before technical acceptance or release.

    Qualification planning & evidence
  4. 04

    Design and material risks

    Introducing a new component, adhesive, packaging material or manufacturing process can change how a product responds to thermal, mechanical and electrical stresses. Issues such as interface degradation, thermal expansion mismatch, wire bond integrity and process variability may not become apparent during initial functional testing. We assess these risks through failure physics, material and process evaluation, and targeted verification, helping engineering teams identify potential weaknesses and make informed design and material selection decisions.

    Design risk assessment & verification

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04 / How Spacerel works

From requirement to engineering conclusion.

  1. 01

    Understand

    Define the failure, mission, product or qualification requirement.

  2. 02

    Engineer

    Develop the investigation, reliability or qualification strategy.

  3. 03

    Execute

    Manage modelling, analysis and the required testing.

  4. 04

    Interpret

    Turn technical evidence into engineering conclusions.

  5. 05

    Deliver

    Provide clear technical reports, recommendations and qualification evidence.

05 / Standards & Methods

Standards-informed. Mission-profile driven.

A standard provides a framework. Your application defines the question. Spacerel connects established methods with the stresses, failure mechanisms and evidence that matter to your programme.

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06 / Resources

A closer look at reliability.

All resources

Let's define the next step

What does your electronics need to withstand?

Tell us about the failure, mission or qualification requirement. We will help define the next engineering step.

Discuss Your Requirement