Energy & Harsh Environments
Reliability engineering for electronic components and assemblies exposed to high temperature, mechanical stress and extended operating periods.
The reliability challenge
Understand the stresses at the component.
Ambient temperature alone may not represent device temperature. Self-heating, duty cycle, electrical loading, vibration and thermal transitions should be assessed together when defining qualification and life-test conditions.
How Spacerel supports the programme
Translate harsh conditions into a testable plan
Spacerel supports high-temperature qualification strategies, materials and interconnect investigations, mission-profile modelling and accelerated-test design. The programme distinguishes time-dependent ageing from cycle-driven damage and documents the assumptions used to relate testing to service.
Discuss the engineering challenge
A clear requirement is the first step.
Tell us about your electronic hardware, reliability or qualification requirements and the decisions you need to make. We'll help identify a practical engineering approach and the evidence needed to move forward.
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