Semiconductor & Microelectronics
Semiconductor reliability engineering for devices, packages and interconnects. Investigate failure mechanisms, assess wire-bond and die-attach reliability, and develop JEDEC-informed qualification strategies.
The reliability challenge
Look across the device and the package.
Electrical stress, temperature, moisture and thermomechanical loading can act on different parts of a device or assembly. Investigation and qualification should consider the die, metallisation, die attach, wire bonds, moulding and interconnect system.
How Spacerel supports the programme
Mechanism-led analysis and testing
Spacerel develops device and package reliability assessments, failure-analysis programmes and JEDEC-informed qualification strategies. The aim is to connect observed behaviour with the mechanism and the application, while making the limits of the evidence clear.
Discuss the engineering challenge
A clear requirement is the first step.
Tell us about your electronic hardware, reliability or qualification requirements and the decisions you need to make. We'll help identify a practical engineering approach and the evidence needed to move forward.
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