Industries / Application context
Semiconductor & Microelectronics
Device, package and interconnect reliability considered together, from failure investigation to qualification evidence.
Request a Technical ConsultationThe reliability challenge
Look across the device and the package.
Electrical stress, temperature, moisture and thermomechanical loading can act on different parts of a device or assembly. Investigation and qualification should consider the die, metallisation, die attach, wire bonds, moulding and interconnect system.
How Spacerel supports the programme
Mechanism-led analysis and testing
Spacerel develops device and package reliability assessments, failure-analysis programmes and JEDEC-informed qualification strategies. The aim is to connect observed behaviour with the mechanism and the application, while making the limits of the evidence clear.
Connected expertise
Related capabilities and technical resources
Discuss the engineering challenge