Supporting capability
Technical Training & Workshops
Equip your engineering team with the knowledge and tools to assess reliability, investigate failures and plan qualification with confidence. SPACEREL delivers tailored, practical workshops for electronics and semiconductor teams, covering Physics of Failure, FMEA/FMECA, accelerated life testing, Weibull analysis, failure analysis and component qualification, with a focus on real product challenges and engineering decisions.
Tailored Training
Reliability engineering training built around your hardware and applications
SPACEREL provides technical training for organisations developing, manufacturing, testing and qualifying electronic components and systems. Programmes address the reliability challenges associated with semiconductor devices, electronic assemblies, PCBAs, hybrid microcircuits, multi-chip modules (MCMs) and high-reliability electronics.
Training combines fundamental engineering principles with practical analysis methods, industry standards and application-specific considerations. Subjects and exercises can be adapted to product requirements, operating environments, failure mechanisms and available test evidence.
Training is suitable for:
- Reliability, product, design and development engineers
- Semiconductor device and microelectronics engineers
- Test, verification, validation and qualification teams
- Failure analysis, manufacturing and quality engineers
- Technical managers responsible for product reliability and qualification
Courses can accommodate different experience levels, from engineers establishing core reliability skills to specialist teams developing advanced capabilities in reliability modelling, failure investigation and qualification.
Training topics
Reliability engineering, semiconductor failure analysis and qualification training
Training is organised into specialist modules that can be delivered individually or combined into a broader programme.
Reliability Engineering & Design for Reliability
- Reliability requirements, mission profiles, reliability allocation and Design for Reliability (DfR)
- Failure Mode and Effects Analysis (FMEA), DFMEA, FMECA and Fault Tree Analysis
- Physics of Failure (PoF), reliability prediction, component derating and risk assessment
- Reliability growth, FRACAS and reliability improvement programmes
Semiconductor & Electronic Packaging Reliability
- Semiconductor degradation mechanisms, including electromigration, TDDB and bias temperature instability
- Wire-bond, die-attach, solder joint, interconnect and hybrid microcircuit reliability
- Thermomechanical fatigue, delamination, corrosion, moisture-related failure and high-temperature ageing
- Failure mechanisms associated with device design, materials, packaging and manufacturing processes
Accelerated Testing & Reliability Statistics
- Accelerated Life Testing (ALT), degradation testing and Reliability Demonstration Testing (RDT)
- Weibull analysis, life distributions, censored data, B-life, MTBF and FIT
- Arrhenius, Eyring, Peck, Coffin–Manson and Norris–Landzberg acceleration models
- Test duration, sample-size determination, confidence levels and acceptance criteria
- Design of Experiments (DOE), statistical analysis and interpretation of reliability test results
Electronic Component & System Qualification
- Qualification strategy, test planning and qualification evidence assessment
- JEDEC JESD22/JESD47, MIL-STD-883 and application-specific qualification requirements
- HTOL, HTSL, temperature cycling, thermal shock, humidity testing, screening and burn-in
- Commercial off-the-shelf (COTS) component selection, assessment, derating and qualification gaps
- Linking component and assembly qualification evidence to system requirements and operating conditions
Failure Analysis & Root-Cause Investigation
- Structured failure investigation, Root-Cause Analysis (RCA) and corrective-action planning
- Electrical characterisation and non-destructive and destructive examination methods
- SEM/EDS, X-ray, acoustic microscopy, cross-sectioning and materials characterisation
- Differentiating failure symptoms, physical damage, degradation mechanisms and root causes
- Investigation planning, evidence interpretation and verification of corrective actions
Modules incorporate the assumptions, applicability and limitations of the methods covered, particularly when interpreting accelerated-test results, statistical confidence and qualification evidence.
Training Delivery
In-house and online technical workshops for engineering teams
SPACEREL offers dedicated training for engineering teams across the UK, Europe and internationally. Delivery formats are selected according to the technical subject, participants' experience and the organisation's requirements.
Training formats include:
- Onsite corporate training: Instructor-led sessions at the client's premises, with content adapted to the organisation's products and engineering activities.
- Live online workshops: Interactive technical sessions for teams working across multiple sites or locations.
- Focused technical workshops: Sessions addressing a particular failure mechanism, reliability analysis method, test strategy or qualification challenge.
- Structured training programmes: Multiple modules covering reliability fundamentals, specialist topics, quantitative analysis and practical exercises.
Workshops combine technical presentations with engineering examples, worked calculations, data interpretation and guided exercises. Participants can examine reliability data, evaluate failure mechanisms, compare analysis methods and develop test or investigation plans.
Training objectives, course content and delivery arrangements are established with the client before the programme begins. Non-confidential or suitably anonymised product examples may be incorporated where appropriate.
Training is provided as professional technical development and does not confer third-party certification or accreditation.
Learning Outcomes
Apply reliability engineering methods to real technical decisions
Participants develop practical skills in reliability assessment, failure analysis and qualification engineering, with learning outcomes aligned to the selected training modules.
These may include the ability to:
- Identify failure mechanisms and assess their relevance to specific designs, materials and operating environments.
- Perform FMEA, reliability predictions and statistical life-data analysis.
- Select accelerated-test conditions and evaluate the underlying acceleration models.
- Calculate reliability demonstration sample sizes, test durations and confidence levels.
- Develop qualification test matrices, acceptance criteria and evidence assessment plans.
- Structure failure investigations and evaluate competing root-cause hypotheses.
- Translate analysis and test findings into engineering recommendations, design improvements and verification actions.
Worked examples and practical exercises connect the methods to activities such as design reviews, component selection, reliability test planning, failure investigation and qualification assessment.
Case-Based Learning
Engineering Case Clinic: Investigating real-world reliability challenges
The Engineering Case Clinic is an optional practical workshop built around an electronic hardware reliability problem.
Using a representative case study or an agreed, anonymised client scenario, participants investigate a failure or qualification concern involving semiconductor devices, electronic packages, PCBAs or high-reliability assemblies.
The investigation follows a structured engineering process:
- Review the observed failure, operating history and available evidence.
- Establish the relevant electrical, thermal, mechanical and environmental conditions.
- Identify potential failure mechanisms and formulate technical hypotheses.
- Select suitable examination, characterisation and reliability testing methods.
- Assess the evidence and distinguish observed damage from underlying root causes.
- Define further investigations, corrective actions and verification requirements.
Cases can address issues such as wire-bond degradation, die-attach failures, thermal fatigue, electrical overstress, material degradation or unexpected reliability test results.
Participants work through the evidence and develop an investigation plan, including failure hypotheses, proposed examination methods and criteria for evaluating the findings.
Engineering Resources
Practical reliability engineering tools and templates
Selected workshops can include engineering worksheets, calculation exercises and planning templates to support the application of reliability methods.
Resources are matched to the training modules and may include:
- Reliability requirements and mission-profile worksheets
- FMEA and failure-mechanism assessment templates
- Weibull and life-data analysis exercises
- Accelerated life testing and Reliability Demonstration Testing worksheets
- Qualification test planning and evidence assessment matrices
- Failure investigation and root-cause analysis checklists
- Corrective-action and verification planning templates
Exercises cover the selection of input parameters, interpretation of results, assessment of model assumptions and identification of limitations.
Where relevant, participants can also use SPACEREL's online reliability calculators to explore acceleration factors, reliability demonstration requirements and life-data relationships.
The worksheets and templates provide a practical reference for subsequent reliability assessments, technical reviews, investigation planning and qualification activities.
Training Arrangements
Planning Your Technical Training
Can the training be tailored to our specific electronic products and reliability challenges?
Yes. SPACEREL develops training around the electronic hardware, operating conditions and reliability challenges relevant to your organisation. Rather than covering reliability methods in isolation, workshops can examine how they apply to semiconductor devices, System-on-Chip (SoC) designs, System-in-Package (SiP) assemblies, hybrid microcircuits, multi-chip modules (MCMs), PCBAs and complete electronic systems.
For example, a team developing high-temperature electronics may require training on material degradation, wire-bond and die-attach reliability, accelerated ageing and lifetime prediction. A semiconductor product engineering team may instead focus on device failure mechanisms, reliability characterisation, qualification testing and interpretation of manufacturing or test data.
Before developing the programme, SPACEREL establishes the team's technical background, product applications and learning objectives. The training content, examples and exercises can then be selected to address the engineering methods participants need to apply in their work.
Can we use our own reliability test results or product failure cases during the workshops?
Yes, where appropriate. Using relevant engineering data can make technical training particularly useful because participants can examine the same types of evidence they encounter during product development, qualification or failure investigation.
For example, a workshop may use anonymised HTOL or temperature cycling results to explore acceleration models, Weibull analysis and reliability demonstration confidence. Alternatively, participants could examine a representative wire-bond, solder joint or semiconductor device failure and develop an investigation strategy using the available electrical, environmental and physical evidence.
The exercise can address questions such as whether the data supports the proposed failure mechanism, what conclusions can reasonably be drawn, and which additional tests or analyses would help resolve uncertainty.
Client information is reviewed for suitability before inclusion. Confidentiality requirements, data handling arrangements and the permitted use of proprietary material are agreed in advance. Where actual product data cannot be shared, SPACEREL can use representative engineering scenarios covering similar technical challenges.
Do you provide onsite training, or can our engineers attend remotely?
SPACEREL offers instructor-led training for engineering teams, with onsite and live online delivery options. UK-based organisations can arrange dedicated training at their premises, while European and international clients can discuss onsite delivery subject to location, scope and practical arrangements.
Onsite sessions can be particularly suitable for workshops involving team-based FMEA, qualification planning, failure investigation exercises or discussions around specific hardware. They allow engineers from design, product, reliability, test and quality functions to examine the same technical challenges together.
Live online workshops offer an alternative for organisations with engineers working across different sites. These sessions can incorporate technical presentations, worked calculations, reliability data interpretation and interactive discussions. More extensive subjects, such as accelerated life testing or semiconductor failure mechanisms, can be divided into separate modules.
The delivery format is selected according to the technical content, number of participants, level of interaction required and whether the training involves client-specific examples or exercises.
Can we combine FMEA, semiconductor reliability and qualification training into a single programme?
Yes. These disciplines are closely connected in electronic product development, and combining them can help engineers understand how reliability risks are identified, analysed, tested and addressed throughout the product lifecycle.
For example, a programme could begin with the product mission profile and reliability requirements, followed by identification of potential failure mechanisms through DFMEA or Physics of Failure analysis. Participants could then examine how those mechanisms influence accelerated test selection, acceleration model assumptions, sample-size requirements and qualification acceptance criteria.
For semiconductor devices and electronic packaging, practical examples may include electromigration, thermal fatigue, wire-bond degradation, die-attach delamination or moisture-related failure mechanisms. The exercises can demonstrate how the selected failure mechanism affects test conditions and the interpretation of qualification evidence.
Modules can be arranged around a particular engineering programme, development stage or technical objective. The sequence and depth are adapted so that participants understand the relationships between the methods rather than treating them as unrelated subjects.
What training materials and practical resources will our engineers receive?
Training materials depend on the technical modules and the scope agreed for the workshop. SPACEREL can provide supporting technical presentations, worked examples, calculation exercises and engineering worksheets designed around the methods covered during the sessions.
For reliability statistics and accelerated testing, exercises may involve Weibull life-data analysis, acceleration factor calculations, reliability demonstration sample sizes or interpretation of zero-failure test results. FMEA and qualification workshops may incorporate failure-mode assessment templates, test planning matrices, acceptance criteria and qualification evidence checklists.
Failure analysis training can include example investigation workflows, failure-mechanism assessment exercises and guidance on selecting examination or characterisation techniques.
Where suitable, participants may also work with SPACEREL's online reliability calculators to explore how assumptions, stress conditions and statistical parameters influence engineering conclusions.
The materials are intended to help participants repeat the relevant analyses, understand their limitations and apply the methods to subsequent design reviews, reliability assessments and qualification activities. The specific resources included are defined as part of the agreed training programme.
Our engineers already use FMEA and reliability analysis. Is the training suitable for experienced teams?
Yes. Training can focus on advanced applications rather than introductory reliability concepts. For example, an experienced team may wish to improve how failure mechanisms are incorporated into DFMEA, evaluate the assumptions behind lifetime prediction models, or strengthen the connection between reliability requirements, accelerated testing and qualification evidence.
Advanced workshops can examine practical limitations of methods such as Weibull analysis, FMECA and Physics of Failure modelling, including how to handle incomplete data, competing failure mechanisms and uncertainty in engineering predictions.
The technical depth is agreed in advance, allowing participants to concentrate on specific challenges rather than repeat methods they already use.
We have accelerated life test results. How can we tell whether they really support our product lifetime requirements?
Accelerated testing can provide valuable reliability evidence, but the relationship between test conditions and service life depends on the failure mechanisms involved and the validity of the acceleration model.
SPACEREL training can examine how to interpret results from HTOL, HTSL, temperature cycling, humidity testing and other accelerated stress tests. Topics include selecting appropriate Arrhenius, Coffin–Manson or other acceleration models, identifying model assumptions, interpreting Weibull life-data distributions and understanding confidence levels.
Workshops can also address zero-failure test results, censored observations, sample-size limitations and the distinction between demonstrating reliability under specified test conditions and predicting long-term field performance.
Engineers learn how to assess whether the available evidence supports a stated reliability objective, where uncertainties remain and when additional testing or analysis may be necessary.
We use commercial electronic components in demanding environments. Can the training help us assess their suitability?
Yes. Training can address the reliability assessment and qualification of commercial off-the-shelf (COTS) semiconductor devices, electronic components and assemblies intended for demanding applications, including aerospace, defence, industrial and high-temperature electronics.
Topics can include interpreting manufacturer qualification data, reviewing datasheet limitations, establishing application mission profiles, component derating, identifying relevant failure mechanisms and assessing qualification gaps.
Workshops can examine the relationship between JEDEC, MIL-STD-883 and applicable project-specific requirements, including why successful component-level qualification does not automatically demonstrate suitability for every operating environment or mission duration.
Practical exercises may involve comparing available component evidence against electrical, thermal, environmental and lifetime requirements, then identifying the additional analysis, screening or testing needed to support component selection.
Our products keep showing similar failures. Can a workshop help our engineers improve how they investigate them?
Yes. SPACEREL can develop workshops around recurring electronic hardware failures, unexpected qualification results or manufacturing reliability concerns.
Training covers the distinction between observed symptoms, physical damage, failure mechanisms and verified root causes. Engineers can work through examples involving wire-bond degradation, die-attach defects, corrosion, electrical overstress, solder fatigue, delamination or semiconductor device failures.
Exercises can address the selection and sequencing of electrical characterisation, X-ray inspection, acoustic microscopy, SEM/EDS, cross-sectioning and other investigation methods, including the strengths and limitations of each technique.
The workshop can also examine how to formulate competing failure hypotheses, evaluate evidence, develop corrective actions and verify their effectiveness. The objective is to strengthen the team's investigation process and reduce the likelihood of drawing conclusions from incomplete or misleading evidence.
A workshop develops investigation capabilities; formal investigation of a specific product failure can be addressed separately through SPACEREL's Failure Analysis service.
How do we decide what the training should cover, and how much time should we allow?
The scope depends on the technical subjects, experience of the participants and level of practical analysis required. A focused session on FMEA, Weibull analysis or a particular semiconductor failure mechanism will have different requirements from a programme covering reliability engineering, accelerated testing and qualification.
SPACEREL works with the client to identify the intended learning outcomes, the engineering activities participants need to perform and any product-specific problems that should be included.
For example, a workshop introducing accelerated life testing may concentrate on stress selection, acceleration factors and test planning. A more advanced session could include life-data analysis, confidence calculations, model validation and interpretation of actual test results.
Training can be organised into focused sessions or multiple modules, with sufficient time for worked examples, technical discussion and practical exercises. The proposed duration, delivery format and training materials are defined in the agreed programme.
Discuss the engineering challenge
A clear requirement is the first step.
Develop your team's expertise in electronic reliability engineering, failure analysis and qualification. Contact SPACEREL to discuss your technical training requirements, engineering applications and preferred delivery format. Workshops can be tailored to your organisation's products, projects and experience levels.
Discuss Training RequirementsConnected expertise