Engineering capability
Failure Analysis
Independent electronic and semiconductor failure analysis for components, PCBAs and hybrid microelectronics. Investigate failure mechanisms, identify root causes and develop evidence-based corrective actions.
Tools and methods
Explore failure analysis
Core Techniques
Primary techniques for locating, exposing and examining physical failure evidence.
Supporting Techniques
Materials analysis used to identify composition, structure and degradation mechanisms.
Define the investigation
Start with the failure, not the instrument.
A useful investigation begins with the observed behaviour, operating history and available evidence. Spacerel develops an investigation plan that considers the component, assembly and system together.
- Electronic component and semiconductor/device failures
- PCBA, MCM and hybrid microelectronics investigations
- Interconnect, solder, wire-bond and die-attach failures
- Field returns, intermittent faults and thermal problems
Preserve the evidence
A sequence designed around the question.
Non-destructive examination and electrical checks should inform any destructive work. The programme can incorporate optical microscopy, X-ray, CT, SAM, SEM/EDX, cross-sectioning or material analysis where these methods address a specific hypothesis.
The sequence, specimen selection and acceptance criteria are agreed before testing. Observations are distinguished from interpretation, and competing explanations are considered.
Engineering outcome
From a failure mechanism to a defensible conclusion.
A damaged feature is not automatically the root cause. Findings must be connected to the design, materials, manufacturing process or operating conditions that could produce them.
- Documented observations and failure-mechanism assessment
- Evidence supporting or rejecting root-cause hypotheses
- Corrective-action and verification recommendations
- A technical report that identifies remaining uncertainties
Technical guide
Understand the failure investigation process
Explore how to preserve evidence, select examination techniques and evaluate possible root causes before planning an investigation.
How Electronic Failure Analysis WorksDiscuss the engineering challenge
A clear requirement is the first step.
Tell us about your electronic hardware, reliability or qualification requirements and the decisions you need to make. We'll help identify a practical engineering approach and the evidence needed to move forward.
Request a Technical ConsultationConnected expertise