Engineering capability
Failure Analysis
Understand how electronic hardware failed, what the evidence supports and which engineering actions follow.
Request a Technical ConsultationDefine the investigation
Start with the failure, not the instrument.
A useful investigation begins with the observed behaviour, operating history and available evidence. Spacerel develops an investigation plan that considers the component, assembly and system together.
- Electronic component and semiconductor/device failures
- PCBA, MCM and hybrid microelectronics investigations
- Interconnect, solder, wire-bond and die-attach failures
- Field returns, intermittent faults and thermal problems
Preserve the evidence
A sequence designed around the question.
Non-destructive examination and electrical checks should inform any destructive work. The programme can incorporate optical microscopy, X-ray, CT, SAM, SEM/EDX, cross-sectioning or material analysis where these methods address a specific hypothesis.
The sequence, specimen selection and acceptance criteria are agreed before testing. Observations are distinguished from interpretation, and competing explanations are considered.
Engineering outcome
From a failure mechanism to a defensible conclusion.
A damaged feature is not automatically the root cause. Findings must be connected to the design, materials, manufacturing process or operating conditions that could produce them.
- Documented observations and failure-mechanism assessment
- Evidence supporting or rejecting root-cause hypotheses
- Corrective-action and verification recommendations
- A technical report that identifies remaining uncertainties
Connected expertise
Related capabilities and technical resources
Discuss the engineering challenge