Lifetime Assessment
Packaging & Interconnect Reliability
Assess the materials and interfaces that often govern microelectronic assembly life.
Purpose & Benefit
When This Activity Helps
Use for hybrid assemblies, MCMs, power electronics and demanding thermal environments. Targeted assessment helps prioritise package, material and process risks before lengthy testing.
Project Information
Typical Inputs
The scope is tailored to the available evidence. Useful inputs include:
- Package construction, materials and geometry
- Thermal cycles, power cycles and mechanical loads
- Wire-bond, die-attach and interconnect evidence
Engineering Approach
How SPACEREL Supports Your Project
SPACEREL examines solder fatigue, wire-bond degradation, die-attach behaviour, substrate interfaces and encapsulation risks. Mission-profile-based damage assessment is combined with available test and failure evidence, with clear limits on extrapolation.
Documented Outcomes
Typical Deliverables
Deliverables are agreed before work starts and can include:
- Packaging and interconnect risk assessment
- Supported damage or lifetime estimates
- Material, design and test recommendations
Reliability Toolkit
Related Calculators
Explore simplified thermal-cycling and thermal-exposure relationships for the assessed mechanism.
Coffin-Manson Thermal Cycling Acceleration Factor
Estimate simplified thermal-cycle acceleration from use and test temperature ranges and a Coffin–Manson fatigue exponent.
Open CalculatorArrhenius Acceleration Factor
Calculate Arrhenius thermal acceleration factor and equivalent use time from activation energy, use temperature and stress temperature.
Open CalculatorMethods & Evidence
Selected References
- IEC Technical Committee 56: Dependability
Select the applicable methods and requirements for the product and programme.
Project Context
Where This Activity Can Help
Explore the relevant lifecycle stages.